Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927498 | Bond pad for flip chip package | Tai-Chun Huang, Ching-Hua Hsieh | 2005-08-09 |
| 6864701 | Test patterns for measurement of effective vacancy diffusion area | Tai-Chun Huang | 2005-03-08 |