Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927498 | Bond pad for flip chip package | Chih-Hsiang Yao, Ching-Hua Hsieh | 2005-08-09 |
| 6864701 | Test patterns for measurement of effective vacancy diffusion area | Chih-Hsiang Yao | 2005-03-08 |
| 6858944 | Bonding pad metal layer geometry design | Tze-Liang Lee | 2005-02-22 |