Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6952052 | Cu interconnects with composite barrier layers for wafer-to-wafer uniformity | Connie P. Wang, Christy Mei-Chu Woo | 2005-10-04 |
| 6939803 | Method for forming conductor reservoir volume for integrated circuit interconnects | Pin-Chin Connie Wang, Christy Mei-Chu Woo | 2005-09-06 |
| 6897476 | Test structure for determining electromigration and interlayer dielectric failure | Hyeon-Seag Kim, Seung-Hyun Rhee, Christine Hau-Riege | 2005-05-24 |
| 6867056 | System and method for current-enhanced stress-migration testing of interconnect | Christine Hau-Riege | 2005-03-15 |
| 6858511 | Method of semiconductor via testing | — | 2005-02-22 |
| 6856160 | Maximum VCC calculation method for hot carrier qualification | Hyeon-Seag Kim, Nian Yang, Tien-Chun Yang | 2005-02-15 |