Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979625 | Copper interconnects with metal capping layer and selective copper alloys | Christy Mei-Chu Woo, Darrell M. Erb | 2005-12-27 |
| 6979642 | Method of self-annealing conductive lines that separates grain size effects from alloy mobility | Matthew S. Buynoski, Paul R. Besser, Minh Quoc Tran | 2005-12-27 |
| 6952052 | Cu interconnects with composite barrier layers for wafer-to-wafer uniformity | Amit P. Marathe, Christy Mei-Chu Woo | 2005-10-04 |
| 6943096 | Semiconductor component and method of manufacture | Suzette K. Pangrle, Sergey Lopatin | 2005-09-13 |
| 6927162 | Method of forming a contact in a semiconductor device with formation of silicide prior to plasma treatment | Wen Yu, Jinsong Yin, Paul R. Besser, Keizaburo Yoshie | 2005-08-09 |