Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974767 | Chemical solution for electroplating a copper-zinc alloy thin film | — | 2005-12-13 |
| 6972254 | Manufacturing a conformal atomic liner layer in an integrated circuit interconnect | Minh Van Ngo | 2005-12-06 |
| 6943096 | Semiconductor component and method of manufacture | Connie P. Wang, Suzette K. Pangrle | 2005-09-13 |
| 6936925 | Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface | Alexander H. Nickel | 2005-08-30 |
| 6900488 | Multi-cell organic memory element and methods of operating and fabricating | Mark S. Chang, Minh Van Ngo, Patrick K. Cheung | 2005-05-31 |
| 6893955 | Manufacturing seedless barrier layers in integrated circuits | Pin-Chin Connie Wang | 2005-05-17 |
| 6893895 | CuS formation by anodic sulfide passivation of copper surface | Uzodinma Okoroanyanwu, Matthew S. Buynoski | 2005-05-17 |
| 6861349 | Method of forming an adhesion layer with an element reactive with a barrier layer | Paul R. Besser, Matthew S. Buynoski, Pin-Chin Connie Wang | 2005-03-01 |