Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979903 | Integrated circuit with dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers | Steven C. Avanzino, Minh Van Ngo | 2005-12-27 |
| 6939803 | Method for forming conductor reservoir volume for integrated circuit interconnects | Amit P. Marathe, Christy Mei-Chu Woo | 2005-09-06 |
| 6893955 | Manufacturing seedless barrier layers in integrated circuits | Sergey Lopatin | 2005-05-17 |
| 6861349 | Method of forming an adhesion layer with an element reactive with a barrier layer | Sergey Lopatin, Paul R. Besser, Matthew S. Buynoski | 2005-03-01 |
| 6841473 | Manufacturing an integrated circuit with low solubility metal-conductor interconnect cap | Steven C. Avanzino | 2005-01-11 |