Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979625 | Copper interconnects with metal capping layer and selective copper alloys | Christy Mei-Chu Woo, Connie P. Wang | 2005-12-27 |
| 6869878 | Method of forming a selective barrier layer using a sacrificial layer | Ercan Adem, John Sanchez, Suzette K. Pangrle | 2005-03-22 |