Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897476 | Test structure for determining electromigration and interlayer dielectric failure | Hyeon-Seag Kim, Seung-Hyun Rhee, Amit P. Marathe | 2005-05-24 |
| 6870262 | Wafer-bonding using solder and method of making the same | Stefan Hau-Riege | 2005-03-22 |
| 6867056 | System and method for current-enhanced stress-migration testing of interconnect | Amit P. Marathe | 2005-03-15 |