Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660656 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2003-12-09 |
| 6632735 | Method of depositing low dielectric constant carbon doped silicon oxide | Wai-Fan Yau, Ju-Hyung Lee, Nasreen Chopra, Tzu-Fang Huang, David Cheung +5 more | 2003-10-14 |
| 6627532 | Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2003-09-30 |
| 6602779 | Method for forming low dielectric constant damascene structure while employing carbon doped silicon oxide planarizing stop layer | Lain-Jong Li, Chung-Chi Ko | 2003-08-05 |
| 6602780 | Method for protecting sidewalls of etched openings to prevent via poisoning | Tsu Shih, Lih-Ping Li, Tien-I Bao, Chung-Chi Ko | 2003-08-05 |
| 6596655 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2003-07-22 |
| 6593247 | Method of depositing low k films using an oxidizing plasma | Tzu-Fang Huang, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2003-07-15 |
| 6562690 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2003-05-13 |
| 6541282 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2003-04-01 |