Issued Patents 2003
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518185 | Integration scheme for non-feature-size dependent cu-alloy introduction | Pin-Chin Connie Wang, Fei Wang, Kashmir Sahota, Steven C. Avanzino, Amit P. Marathe +2 more | 2003-02-11 |
| 6509267 | Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layer | Suzette K. Pangrle, Connie P. Wang | 2003-01-21 |
| 6506668 | Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability | Connie P. Wang, Steve Avanzino | 2003-01-14 |
| 6507123 | Nickel silicide process using UDOX to prevent silicide shorting | Minh Van Ngo, Jacques Bertrand | 2003-01-14 |