Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6509267 | Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layer | Christy Mei-Chu Woo, Suzette K. Pangrle | 2003-01-21 |
| 6506668 | Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability | Christy Mei-Chu Woo, Steve Avanzino | 2003-01-14 |