Issued Patents 2002
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498391 | Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same | Lian-Cherng Chiang, Michael Chang | 2002-12-24 |
| 6483039 | Substrate of semiconductor package | Tzong-Da Ho, Chen-Hsu Hsiao | 2002-11-19 |
| 6479894 | Layout method for thin and fine ball grid array package substrate with plating bus | Tzong-Da Ho | 2002-11-12 |
| 6472743 | Semiconductor package with heat dissipating structure | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chih Chan, Ming-Chih Hsieh | 2002-10-29 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Tzong-Da Ho, Han-Ping Pu | 2002-10-22 |
| 6462405 | Semiconductor package | Cheng-Yuan Lai | 2002-10-08 |
| 6462422 | Intercrossedly-stacked dual-chip semiconductor package | — | 2002-10-08 |
| 6458626 | Fabricating method for semiconductor package | Tzong-Da Ho, Cheng-Hsu Hsiao | 2002-10-01 |
| 6459144 | Flip chip semiconductor package | Han-Ping Pu, Shih-Kuang Chiu, Keng-Yuan Liao | 2002-10-01 |
| 6452268 | Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body | — | 2002-09-17 |
| 6443351 | Method of achieving solder ball coplanarity on ball grid array integrated circuit package | Tzong-Da Ho | 2002-09-03 |
| 6444498 | Method of making semiconductor package with heat spreader | Tzong-Da Ho, Cheng-Hsu Hsiao | 2002-09-03 |
| 6437447 | Dual-sided chip package without a die pad | Chin-Yuan Hung, Chang-Fu Chen, Jenn-Shyh Yu, Jui-Hsiang Hung | 2002-08-20 |
| 6429512 | Ball grid array integrated circuit package with palladium coated heat-dissipation device | Chien Yuan Tsui, Niang Yi Cheng | 2002-08-06 |
| 6427976 | Lead-frame-based chip-scale package and method of manufacturing the same | Eric Ko | 2002-08-06 |
| 6429047 | Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same | — | 2002-08-06 |
| 6414385 | Quad flat non-lead package of semiconductor | Eric Ko | 2002-07-02 |
| 6414384 | Package structure stacking chips on front surface and back surface of substrate | Randy Lo, Chi-Chuan Wu | 2002-07-02 |
| 6400014 | Semiconductor package with a heat sink | Cheng-Yuan Lai, Tzu-Yi Tien, Chih-Ming Huang | 2002-06-04 |
| 6396707 | Ball grid array package | Grace Yang | 2002-05-28 |
| 6396139 | Semiconductor package structure with exposed die pad | — | 2002-05-28 |
| 6384472 | Leadless image sensor package structure and method for making the same | — | 2002-05-07 |
| 6380059 | Method of breaking electrically conductive traces on substrate into open-circuited state | Tzong-Da Ho, Chiao-Yi Lee | 2002-04-30 |
| 6372551 | Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability | — | 2002-04-16 |
| 6369455 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Tzong-Da Ho, Jeng-Yuan Lai | 2002-04-09 |