Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437447 | Dual-sided chip package without a die pad | Chien-Ping Huang, Chin-Yuan Hung, Jenn-Shyh Yu, Jui-Hsiang Hung | 2002-08-20 |
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chin-Yuan Hung, Fu Tang | 2002-05-28 |