Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chin-Yuan Hung, Chang-Fu Chen | 2002-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chin-Yuan Hung, Chang-Fu Chen | 2002-05-28 |