Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495908 | Multi-chip semiconductor package | Cheng-Hsung Yang, Jian LIU | 2002-12-17 |
| 6476469 | Quad flat non-leaded package structure for housing CMOS sensor | Lien-Chen Chiang, Cheng-Shiu Hsiao | 2002-11-05 |
| 6476474 | Dual-die package structure and method for fabricating the same | — | 2002-11-05 |
| 6437447 | Dual-sided chip package without a die pad | Chien-Ping Huang, Chang-Fu Chen, Jenn-Shyh Yu, Jui-Hsiang Hung | 2002-08-20 |
| 6396129 | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package | Chang-Fu Chen, Fu Tang | 2002-05-28 |