Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Eing-Chieh Chen, Cheng-Yuan Lai | 2002-10-29 |
| 6400014 | Semiconductor package with a heat sink | Chien-Ping Huang, Cheng-Yuan Lai, Chih-Ming Huang | 2002-06-04 |