Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Cheng-Yuan Lai, Tzu-Yi Tien | 2002-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472741 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Cheng-Yuan Lai, Tzu-Yi Tien | 2002-10-29 |