Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501164 | Multi-chip semiconductor package with heat dissipating structure | Ying Chen, Jzu-Yi Tien, Chiung-Kai Yang | 2002-12-31 |
| 6369455 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Tzong-Da Ho, Chien-Ping Huang | 2002-04-09 |