Issued Patents 2002
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483039 | Substrate of semiconductor package | Chien-Ping Huang, Chen-Hsu Hsiao | 2002-11-19 |
| 6479894 | Layout method for thin and fine ball grid array package substrate with plating bus | Chien-Ping Huang | 2002-11-12 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Chien-Ping Huang, Han-Ping Pu | 2002-10-22 |
| 6458626 | Fabricating method for semiconductor package | Chien-Ping Huang, Cheng-Hsu Hsiao | 2002-10-01 |
| 6451625 | Method of fabricating a flip-chip ball-grid-array package with molded underfill | Han-Ping Pu | 2002-09-17 |
| 6449169 | Ball grid array package with interdigitated power ring and ground ring | Chih-Chin Liao, Chien-Te Chen | 2002-09-10 |
| 6444498 | Method of making semiconductor package with heat spreader | Chien-Ping Huang, Cheng-Hsu Hsiao | 2002-09-03 |
| 6443351 | Method of achieving solder ball coplanarity on ball grid array integrated circuit package | Chien-Ping Huang | 2002-09-03 |
| 6440779 | Semiconductor package based on window pad type of leadframe and method of fabricating the same | Fly Chiu, Audi Chen | 2002-08-27 |
| 6380059 | Method of breaking electrically conductive traces on substrate into open-circuited state | Chien-Ping Huang, Chiao-Yi Lee | 2002-04-30 |
| 6369455 | Externally-embedded heat-dissipating device for ball grid array integrated circuit package | Chien-Ping Huang, Jeng-Yuan Lai | 2002-04-09 |
| 6359341 | Ball grid array integrated circuit package structure | Chien-Ping Huang, Kevin Chiang | 2002-03-19 |