Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465891 | Integrated-circuit package with a quick-to-count finger layout design on substrate | Wen-Hsin Wang | 2002-10-15 |
| 6449169 | Ball grid array package with interdigitated power ring and ground ring | Tzong-Da Ho, Chien-Te Chen | 2002-09-10 |
| 6399417 | Method of fabricating plated circuit lines over ball grid array substrate | Wen-Cheng Lee | 2002-06-04 |
| 6391666 | Method for identifying defective elements in array molding of semiconductor packaging | Ya-Hui Huang, Tzong-Dar Her | 2002-05-21 |
| 6392425 | Multi-chip packaging having non-sticking test structure | April Chen, Tzong-Dar Her | 2002-05-21 |