Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391666 | Method for identifying defective elements in array molding of semiconductor packaging | Ya-Hui Huang, Chih-Chin Liao | 2002-05-21 |
| 6392425 | Multi-chip packaging having non-sticking test structure | April Chen, Chih-Chin Liao | 2002-05-21 |