Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498054 | Method of underfilling a flip-chip semiconductor device | Shih-Kuang Chiu, Ying-Chou Tsai | 2002-12-24 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Tzong-Da Ho, Chien-Ping Huang | 2002-10-22 |
| 6459144 | Flip chip semiconductor package | Shih-Kuang Chiu, Keng-Yuan Liao, Chien-Ping Huang | 2002-10-01 |
| 6451625 | Method of fabricating a flip-chip ball-grid-array package with molded underfill | Tzong-Da Ho | 2002-09-17 |
| 6400036 | Flip-chip package structure and method of fabricating the same | Wei-Sen Tang | 2002-06-04 |
| 6350669 | Method of bonding ball grid array package to circuit board without causing package collapse | Chien-Ping Huang | 2002-02-26 |