Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498054 | Method of underfilling a flip-chip semiconductor device | Ying-Chou Tsai, Han-Ping Pu | 2002-12-24 |
| 6489180 | Flip-chip packaging process utilizing no-flow underfill technique | Ying-Chou Tsai | 2002-12-03 |
| 6459144 | Flip chip semiconductor package | Han-Ping Pu, Keng-Yuan Liao, Chien-Ping Huang | 2002-10-01 |
| 6404064 | Flip-chip bonding structure on substrate for flip-chip package application | Ying-Chou Tsai, Kuo-Liang Mao, Chao-Dung Suo | 2002-06-11 |
| 6396156 | Flip-chip bonding structure with stress-buffering property and method for making the same | Wen-Sen Tang | 2002-05-28 |
| 6391683 | Flip-chip semiconductor package structure and process for fabricating the same | Ying-Chou Tsai | 2002-05-21 |
| 6391682 | Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module | Ying-Chou Tsai | 2002-05-21 |
| 6348740 | Bump structure with dopants | Ying-Chou Tsai, Chao-Dung Suo, Kuo-Liang Mao | 2002-02-19 |