Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6404064 | Flip-chip bonding structure on substrate for flip-chip package application | Ying-Chou Tsai, Shih-Kuang Chiu, Chao-Dung Suo | 2002-06-11 |
| 6348740 | Bump structure with dopants | Shih-Kuang Chiu, Ying-Chou Tsai, Chao-Dung Suo | 2002-02-19 |