Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498054 | Method of underfilling a flip-chip semiconductor device | Shih-Kuang Chiu, Han-Ping Pu | 2002-12-24 |
| 6489180 | Flip-chip packaging process utilizing no-flow underfill technique | Shih-Kuang Chiu | 2002-12-03 |
| 6404064 | Flip-chip bonding structure on substrate for flip-chip package application | Shih-Kuang Chiu, Kuo-Liang Mao, Chao-Dung Suo | 2002-06-11 |
| 6391683 | Flip-chip semiconductor package structure and process for fabricating the same | Shih-Kuang Chiu | 2002-05-21 |
| 6391682 | Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module | Shih-Kuang Chiu | 2002-05-21 |
| 6380633 | Pattern layout structure in substrate | — | 2002-04-30 |
| 6348740 | Bump structure with dopants | Shih-Kuang Chiu, Chao-Dung Suo, Kuo-Liang Mao | 2002-02-19 |