Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495910 | Package structure for accommodating thicker semiconductor unit | — | 2002-12-17 |
| 6472743 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chih Chan, Ming-Chih Hsieh | 2002-10-29 |
| 6455355 | Method of mounting an exposed-pad type of semiconductor device over a printed circuit board | Chieh-Yuan Lin, Jui-Yi Chuang | 2002-09-24 |
| 6414384 | Package structure stacking chips on front surface and back surface of substrate | Randy Lo, Chien-Ping Huang | 2002-07-02 |
| 6353256 | IC package structure for achieving better heat dissipation | — | 2002-03-05 |