Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6427976 | Lead-frame-based chip-scale package and method of manufacturing the same | Chien-Ping Huang | 2002-08-06 |
| 6414385 | Quad flat non-lead package of semiconductor | Chien-Ping Huang | 2002-07-02 |