Issued Patents 1997
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702956 | Test site and a method of monitoring via etch depths for semiconductor devices | Shu-Lan Ying, Jue-Jye Chen, Yuh-Jier Mii | 1997-12-30 |
| 5679211 | Spin-on-glass etchback planarization process using an oxygen plasma to remove an etchback polymer residue | — | 1997-10-21 |
| 5672914 | Dimple-free tungsten plug | Huang-Hui Chang | 1997-09-30 |
| 5670019 | Removal process for tungsten etchback precipitates | — | 1997-09-23 |
| 5671119 | Process for cleaning an electrostatic chuck of a plasma etching apparatus | Shzh-Kuei Yen | 1997-09-23 |
| 5668038 | One step smooth cylinder surface formation process in stacked cylindrical DRAM products | Chen-Jong Wang, Mong-Song Liang | 1997-09-16 |
| 5641382 | Method to remove residue of metal etch | Tsu Shih, Chih-Chien Hung | 1997-06-24 |
| 5639345 | Two step etch back process having a convex and concave etch profile for improved etch uniformity across a substrate | Yu Chen-Hua Douglas | 1997-06-17 |
| 5631197 | Sacrificial etchback layer for improved spin-on-glass planarization | Chen-Hua Yu, Syun-Ming Jang, Lung Chen | 1997-05-20 |