Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702977 | Shallow trench isolation method employing self-aligned and planarized trench fill dielectric layer | Ying-Ho Chen, Chen-Hua Yu | 1997-12-30 |
| 5700737 | PECVD silicon nitride for etch stop mask and ozone TEOS pattern sensitivity elimination | Chen-Hua Yu | 1997-12-23 |
| 5674783 | Method for improving the chemical-mechanical polish (CMP) uniformity of insulator layers | Chen-Hua Yu | 1997-10-07 |
| 5674784 | Method for forming polish stop layer for CMP process | Chen-Hua Yu | 1997-10-07 |
| 5631197 | Sacrificial etchback layer for improved spin-on-glass planarization | Chen-Hua Yu, Lung Chen, Yuan-Chang Huang | 1997-05-20 |
| 5622894 | Process to minimize a seam in tungsten filled contact holes | Yu Chen-Hua Douglas | 1997-04-22 |
| 5599740 | Deposit-etch-deposit ozone/teos insulator layer method | Chen-Hua Yu | 1997-02-04 |