| 12418988 |
Inductor-integrating embedded support frame and substrate, and manufacturing method thereof |
Wenshi Wang, Lei Feng, Benxia HUANG |
2025-09-16 |
| 12412843 |
Support frame structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Jindong FENG, Jiangjiang ZHAO, Wenshi Wang |
2025-09-09 |
| 12402414 |
Capacitor and inductor embedded structure and manufacturing method therefor, and substrate |
Lei Feng, Weiyuan YANG, Benxia HUANG, Yejie HONG |
2025-08-26 |
| 12400967 |
Embedded packaging structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yue BAO, Wenshi Wang |
2025-08-26 |
| 12300576 |
Cyclic cooling embedded packaging substrate and manufacturing method thereof |
Yejie HONG, Benxia HUANG, Lei Feng |
2025-05-13 |
| 12300511 |
Fabrication method for package structure |
Yuanming Chen, Lei Feng, Benxia HUANG, Yongzhi Zeng, Wei He +1 more |
2025-05-13 |
| 12302508 |
Temporary carrier and method for manufacturing coreless substrate thereby |
Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng, Bingsen Xie +1 more |
2025-05-13 |
| 12278227 |
Hybrid embedded packaging structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yejie HONG |
2025-04-15 |
| 12279377 |
Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same |
Xiaowei Xu, Gao HUANG, Benxia HUANG |
2025-04-15 |
| 12256265 |
Data transmission method and apparatus, and storage medium |
Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang |
2025-03-18 |
| 12230581 |
Multi-device graded embedding package substrate and manufacturing method thereof |
Lei Feng, Benxia HUANG, Yejie HONG |
2025-02-18 |
| 12166700 |
System and method for transmitting a signal |
Kun Liu, Bo Dai, Weiwei Yang, Huiying Fang |
2024-12-10 |
| 12148676 |
Embedded chip package and manufacturing method thereof |
Jindong FENG, Benxia HUANG, Lei Feng, Wenshi Wang |
2024-11-19 |
| 12074115 |
Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate |
Bingsen Xie, Benxia HUANG, Lei Feng |
2024-08-27 |
| 12040526 |
Method for manufacturing embedded package structure having air resonant cavity |
Lei Feng, Benxia HUANG, Jindong FENG, Yejie HONG |
2024-07-16 |
| 12040272 |
Connector for implementing multi-faceted interconnection |
Lei Feng, Benxia HUANG, Yejie HONG |
2024-07-16 |
| 12002734 |
Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof |
Lei Feng, Benxia HUANG, Jindong FENG, Minxiong Li, Shigui Xin +1 more |
2024-06-04 |
| 11984414 |
Packaging structure with antenna and manufacturing method thereof |
Lei Feng, Wenshi Wang, Benxia HUANG |
2024-05-14 |
| 11961743 |
Substrate manufacturing method for realizing three-dimensional packaging |
Yejie HONG, Benxia HUANG, Lei Feng |
2024-04-16 |
| 11942465 |
Embedded structure, manufacturing method thereof and substrate |
Bingsen Xie, Benxia HUANG, Lei Feng, Wenshi Wang |
2024-03-26 |
| 11924012 |
Signal transmitting method, device, and storage medium |
Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang |
2024-03-05 |
| 11903133 |
Structure for embedding and packaging multiple devices by layer and method for manufacturing same |
Lei Feng, Gao HUANG, Benxia HUANG, Yejie HONG |
2024-02-13 |
| 11882536 |
System and method for transmitting a signal |
Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang |
2024-01-23 |
| 11854920 |
Embedded chip package and manufacturing method thereof |
Jindong FENG, Benxia HUANG, Lei Feng, Wenshi Wang |
2023-12-26 |
| 11822121 |
Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof |
Lei Feng, Benxia HUANG, Wenshi Wang, Lina JIANG |
2023-11-21 |