Issued Patents All Time
Showing 25 most recent of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418988 | Inductor-integrating embedded support frame and substrate, and manufacturing method thereof | Wenshi Wang, Lei Feng, Benxia HUANG | 2025-09-16 |
| 12412843 | Support frame structure and manufacturing method thereof | Lei Feng, Benxia HUANG, Jindong FENG, Jiangjiang ZHAO, Wenshi Wang | 2025-09-09 |
| 12400967 | Embedded packaging structure and manufacturing method thereof | Lei Feng, Benxia HUANG, Yue BAO, Wenshi Wang | 2025-08-26 |
| 12402414 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Lei Feng, Weiyuan YANG, Benxia HUANG, Yejie HONG | 2025-08-26 |
| 12302508 | Temporary carrier and method for manufacturing coreless substrate thereby | Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng, Bingsen Xie +1 more | 2025-05-13 |
| 12300576 | Cyclic cooling embedded packaging substrate and manufacturing method thereof | Yejie HONG, Benxia HUANG, Lei Feng | 2025-05-13 |
| 12300511 | Fabrication method for package structure | Yuanming Chen, Lei Feng, Benxia HUANG, Yongzhi Zeng, Wei He +1 more | 2025-05-13 |
| 12278227 | Hybrid embedded packaging structure and manufacturing method thereof | Lei Feng, Benxia HUANG, Yejie HONG | 2025-04-15 |
| 12279377 | Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same | Xiaowei Xu, Gao HUANG, Benxia HUANG | 2025-04-15 |
| 12256265 | Data transmission method and apparatus, and storage medium | Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang | 2025-03-18 |
| 12230581 | Multi-device graded embedding package substrate and manufacturing method thereof | Lei Feng, Benxia HUANG, Yejie HONG | 2025-02-18 |
| 12166700 | System and method for transmitting a signal | Kun Liu, Bo Dai, Weiwei Yang, Huiying Fang | 2024-12-10 |
| 12148676 | Embedded chip package and manufacturing method thereof | Jindong FENG, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-11-19 |
| 12074115 | Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate | Bingsen Xie, Benxia HUANG, Lei Feng | 2024-08-27 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Lei Feng, Benxia HUANG, Jindong FENG, Yejie HONG | 2024-07-16 |
| 12040272 | Connector for implementing multi-faceted interconnection | Lei Feng, Benxia HUANG, Yejie HONG | 2024-07-16 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Lei Feng, Benxia HUANG, Jindong FENG, Minxiong Li, Shigui Xin +1 more | 2024-06-04 |
| 11984414 | Packaging structure with antenna and manufacturing method thereof | Lei Feng, Wenshi Wang, Benxia HUANG | 2024-05-14 |
| 11961743 | Substrate manufacturing method for realizing three-dimensional packaging | Yejie HONG, Benxia HUANG, Lei Feng | 2024-04-16 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Bingsen Xie, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-03-26 |
| 11924012 | Signal transmitting method, device, and storage medium | Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang | 2024-03-05 |
| 11903133 | Structure for embedding and packaging multiple devices by layer and method for manufacturing same | Lei Feng, Gao HUANG, Benxia HUANG, Yejie HONG | 2024-02-13 |
| 11882536 | System and method for transmitting a signal | Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang | 2024-01-23 |
| 11854920 | Embedded chip package and manufacturing method thereof | Jindong FENG, Benxia HUANG, Lei Feng, Wenshi Wang | 2023-12-26 |
| 11822121 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Lei Feng, Benxia HUANG, Wenshi Wang, Lina JIANG | 2023-11-21 |