Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12302508 | Temporary carrier and method for manufacturing coreless substrate thereby | Xianming Chen, Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng +1 more | 2025-05-13 |
| 12074115 | Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate | Xianming Chen, Benxia HUANG, Lei Feng | 2024-08-27 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-03-26 |
| 11399440 | Method for manufacturing coreless substrate | Xianming Chen, Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng +1 more | 2022-07-26 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Yejie HONG, Benxia HUANG, Lei Feng | 2022-05-24 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Xianming Chen, Min Gu, Benxia HUANG, Lei Feng | 2022-02-22 |
| 9852734 | Systems and methods for time-scale modification of audio signals | Zhuojin SUN | 2017-12-26 |