Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418988 | Inductor-integrating embedded support frame and substrate, and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2025-09-16 |
| 12412843 | Support frame structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Jiangjiang ZHAO | 2025-09-09 |
| 12400967 | Embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Yue BAO | 2025-08-26 |
| 12148676 | Embedded chip package and manufacturing method thereof | Xianming Chen, Jindong FENG, Benxia HUANG, Lei Feng | 2024-11-19 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Minxiong Li +1 more | 2024-06-04 |
| 11984414 | Packaging structure with antenna and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2024-05-14 |
| 11942465 | Embedded structure, manufacturing method thereof and substrate | Xianming Chen, Bingsen Xie, Benxia HUANG, Lei Feng | 2024-03-26 |
| 11854920 | Embedded chip package and manufacturing method thereof | Xianming Chen, Jindong FENG, Benxia HUANG, Lei Feng | 2023-12-26 |
| 11822121 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Lina JIANG | 2023-11-21 |
| 11579362 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Lina JIANG | 2023-02-14 |
| 11569177 | Support frame structure and manufacturing method thereof | Xianming Chen, Jindong FENG, Benxia HUANG, Lei Feng, Jiangjiang ZHAO | 2023-01-31 |
| 11450619 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Xianming Chen, Min Gu, Lei Feng, Lina JIANG, Benxia HUANG | 2022-09-20 |
| 11255149 | Multifunctional directional wireline core drilling device | Longlong Cao, Hengchun Zhang, Jia Yan, Jie Xu | 2022-02-22 |
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Weiyuan YANG, Minxiong Li, Benxia HUANG, Lei Feng | 2021-09-07 |