Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412843 | Support frame structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jiangjiang ZHAO, Wenshi Wang | 2025-09-09 |
| 12148676 | Embedded chip package and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2024-11-19 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Xianming Chen, Lei Feng, Benxia HUANG, Yejie HONG | 2024-07-16 |
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Minxiong Li, Shigui Xin +1 more | 2024-06-04 |
| 11854920 | Embedded chip package and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2023-12-26 |
| 11569177 | Support frame structure and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Jiangjiang ZHAO, Wenshi Wang | 2023-01-31 |