Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002734 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG, Shigui Xin +1 more | 2024-06-04 |
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Wenshi Wang, Weiyuan YANG, Benxia HUANG, Lei Feng | 2021-09-07 |
| 10683297 | Substituted heteroaryl compounds and methods of use | Ning Xi, Ju Peng, Xiaobo Li, Tao Zhang, Haiyang Hu +4 more | 2020-06-16 |
| 10266521 | Substituted heteroaryl compounds and methods of use | Ning Xi, Xiaobo Li, Wuhong Chen, Tao Zhang, Haiyang Hu +2 more | 2019-04-23 |
| 10059689 | Substituted heteroaryl compounds and methods of use | Ning Xi, Xiaobo Li, Weilong Dai, Haiyang Hu, Tao Zhang +1 more | 2018-08-28 |
| 9938257 | Substituted heteroaryl compounds and methods of use | Ning Xi, Xiaobo Li, Wuhong Chen, Tao Zhang, Haiyang Hu +2 more | 2018-04-10 |
| 9403801 | Substituted heteroaryl compounds and methods of use | Ning Xi, Haiyang Hu, Weilong Dai | 2016-08-02 |
| 9399637 | Substituted heteroaryl compounds and methods of use | Ning Xi, Xiaobo Li, Tao Zhang, Yanjun Wu | 2016-07-26 |
| 9394281 | Substituted heteroaryl compounds and methods of use | Ning Xi, Xiaobo Li, Weilong Dai, Tingjin Wang | 2016-07-19 |