Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402414 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Xianming Chen, Lei Feng, Benxia HUANG, Yejie HONG | 2025-08-26 |
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Wenshi Wang, Minxiong Li, Benxia HUANG, Lei Feng | 2021-09-07 |