Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402414 | Capacitor and inductor embedded structure and manufacturing method therefor, and substrate | Xianming Chen, Lei Feng, Weiyuan YANG, Benxia HUANG | 2025-08-26 |
| 12300576 | Cyclic cooling embedded packaging substrate and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng | 2025-05-13 |
| 12278227 | Hybrid embedded packaging structure and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2025-04-15 |
| 12230581 | Multi-device graded embedding package substrate and manufacturing method thereof | Xianming Chen, Lei Feng, Benxia HUANG | 2025-02-18 |
| 12040272 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Benxia HUANG | 2024-07-16 |
| 12040526 | Method for manufacturing embedded package structure having air resonant cavity | Xianming Chen, Lei Feng, Benxia HUANG, Jindong FENG | 2024-07-16 |
| 11961743 | Substrate manufacturing method for realizing three-dimensional packaging | Xianming Chen, Benxia HUANG, Lei Feng | 2024-04-16 |
| 11903133 | Structure for embedding and packaging multiple devices by layer and method for manufacturing same | Xianming Chen, Lei Feng, Gao HUANG, Benxia HUANG | 2024-02-13 |
| 11769733 | Package substrate | Xianming Chen, Benxia HUANG, Lei Feng | 2023-09-26 |
| 11682621 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Benxia HUANG | 2023-06-20 |
| 11515258 | Package substrate and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng | 2022-11-29 |
| 11503712 | Passive device packaging structure embedded in glass medium and method for manufacturing the same | Xianming Chen, Benxia HUANG, Lei Feng | 2022-11-15 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Benxia HUANG, Lei Feng, Bingsen Xie | 2022-05-24 |