Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769733 | Package substrate | Yejie HONG, Benxia HUANG, Lei Feng | 2023-09-26 |
| 11770859 | Information transmission method, and base station, terminal and computer-readable storage medium | Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang | 2023-09-26 |
| 11743902 | Information transmission method and apparatus | Weiwei Yang, Bo Dai, Kun Liu, Huiying Fang | 2023-08-29 |
| 11722854 | Multicast transmission method and apparatus, and computer storage medium | Bo Dai, Jianxun Ai, Kun Liu, Weiwei Yang, Huiying Fang | 2023-08-08 |
| 11689333 | Signal transmission method and system | Kun Liu, Bo Dai, Weiwei Yang, Huiying Fang | 2023-06-27 |
| 11682621 | Connector for implementing multi-faceted interconnection | Lei Feng, Benxia HUANG, Yejie HONG | 2023-06-20 |
| 11653364 | Methods and apparatus for configuring a scheduling request | Bo Dai, Huiying Fang, Weiwei Yang, Kun Liu | 2023-05-16 |
| 11595183 | Joint resource assigning method and device for allocating resources to terminal | Huiying Fang, Bo Dai, Weiwei Yang, Kun Liu | 2023-02-28 |
| 11595166 | Data transmission method and apparatus | Bo Dai, Jing Shi, Shuqiang Xia, Wen Zhang, Huiying Fang | 2023-02-28 |
| 11579362 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Lei Feng, Benxia HUANG, Wenshi Wang, Lina JIANG | 2023-02-14 |
| 11569177 | Support frame structure and manufacturing method thereof | Jindong FENG, Benxia HUANG, Lei Feng, Jiangjiang ZHAO, Wenshi Wang | 2023-01-31 |
| 11515258 | Package substrate and manufacturing method thereof | Yejie HONG, Benxia HUANG, Lei Feng | 2022-11-29 |
| 11503712 | Passive device packaging structure embedded in glass medium and method for manufacturing the same | Yejie HONG, Benxia HUANG, Lei Feng | 2022-11-15 |
| 11450619 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Min Gu, Lei Feng, Lina JIANG, Benxia HUANG, Wenshi Wang | 2022-09-20 |
| 11399332 | Message transmission method and apparatus | Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang | 2022-07-26 |
| 11399440 | Method for manufacturing coreless substrate | Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng, Bingsen Xie +1 more | 2022-07-26 |
| 11381434 | Signal transmitting method, device and system, and storage medium | Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang | 2022-07-05 |
| 11382089 | Information transmission method and device, storage medium and electronic device | Bo Dai, Huiying Fang, Kun Liu, Weiwei Yang | 2022-07-05 |
| 11356215 | System and method for transmitting a signal | Kun Liu, Bo Dai, Weiwei Yang, Huiying Fang | 2022-06-07 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Yejie HONG, Benxia HUANG, Lei Feng, Bingsen Xie | 2022-05-24 |
| 11343811 | Data transmitting method and device, and storage medium | Bo Dai, Kun Liu | 2022-05-24 |
| 11336404 | Data transmission method and apparatus | Bo Dai, Kun Liu, Weiwei Yang, Huiying Fang | 2022-05-17 |
| 11284446 | Information transmission method, and base station, terminal and computer-readable storage medium | Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang | 2022-03-22 |
| 11283568 | Signal sending method and apparatus, signal receiving method and apparatus, and computer storage medium | Huiying Fang, Bo Dai, Wei-Chiang Lin, Shupeng Li | 2022-03-22 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Min Gu, Benxia HUANG, Lei Feng, Bingsen Xie | 2022-02-22 |