Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10539456 | Combi-sensor systems | Douglas S. Silkwood, Jason Zedlitz, Stephen Clark Brown, Dhairya Shrivastava | 2020-01-21 |
| 10303035 | Self-contained EC IGU | Stephen Clark Brown, Dhairya Shrivastava, Trevor Frank, Douglas S. Silkwood | 2019-05-28 |
| 10234596 | Sunlight intensity or cloud detection with variable distance sensing | Trevor Frank, Alexander Rumer, Brandon D. Tinianov, James Fox, Douglas S. Silkwood | 2019-03-19 |
| 9508593 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Michal Danek | 2016-11-29 |
| 9099535 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Michal Danek | 2015-08-04 |
| 8858763 | Apparatus and methods for deposition and/or etch selectivity | Robert T. Rozbicki, Girish Dixit | 2014-10-14 |
| 8679972 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Michal Danek | 2014-03-25 |
| 8207062 | Method for improving adhesion of low resistivity tungsten/tungsten nitride layers | Juwen Gao, Wei Lei, Michal Danek, Sean Chang, Ron Powell | 2012-06-26 |
| 7510634 | Apparatus and methods for deposition and/or etch selectivity | Robert T. Rozbicki, Girish Dixit | 2009-03-31 |
| 6905959 | Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Kwok Fai Lai, Karl B. Levy, J. Patrick Rymer | 2005-06-14 |
| 6642146 | Method of depositing copper seed on semiconductor substrates | Robert T. Rozbicki, Michal Danek | 2003-11-04 |
| 6607977 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Michal Danek | 2003-08-19 |
| 6566246 | Deposition of conformal copper seed layers by control of barrier layer morphology | Tarek Suwwan de Felipe, Michal Danek, Alexander Dulkin | 2003-05-20 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Michal Danek, Karl B. Levy, Jonathan D. Reid +2 more | 2003-04-29 |
| 6541374 | Method of depositing a diffusion barrier for copper interconnection applications | Tarek Suwwan de Felipe, Michal Danek, Ronald A. Powell | 2003-04-01 |
| 6541371 | Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Kwok Fai Lai, Karl B. Levy, J. Patrick Rymer | 2003-04-01 |
| 6319842 | Method of cleansing vias in semiconductor wafer having metal conductive layer | Mukul Khosla, Lap Tam, Ronald A. Powell, Ronald D. Allen, Robert T. Rozbicki +1 more | 2001-11-20 |