Issued Patents All Time
Showing 126–150 of 184 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633198 | Method of forming wiring with gaps in bend to improve electromigration resistance | Jiun-Yuan Wu | 1997-05-27 |
| 5612252 | Method of forming metallization to improve electromigration resistance | Jiun-Yuan Wu | 1997-03-18 |
| 5604148 | Process of fabricating stacked capacitor configuration for dynamic random access memory | — | 1997-02-18 |
| 5599746 | Method to eliminate polycide peeling at wafer edge using extended scribe lines | Der-Yuan Wu | 1997-02-04 |
| 5580701 | Process for elimination of standing wave effect of photoresist | Po-Wen Yen | 1996-12-03 |
| 5574302 | Field effect transistor structure of a diving channel device | Jemmy Wen, Joe Ko | 1996-11-12 |
| 5565376 | Device isolation technology by liquid phase deposition | Lawrence Lin | 1996-10-15 |
| 5554566 | Method to eliminate polycide peeling | Cheng-Han Huang | 1996-09-10 |
| 5529948 | LOCOS technology with reduced junction leakage | Dey Y. Wu, Jiunn Y. Wu | 1996-06-25 |
| 5516720 | Stress relaxation in dielectric before metallization | Edward Houn | 1996-05-14 |
| 5517062 | Stress released VLSI structure by the formation of porous intermetal layer | J. Y. Wu | 1996-05-14 |
| 5516369 | Method and apparatus for particle reduction from semiconductor wafers | Yu DANG | 1996-05-14 |
| 5512768 | Capacitor for use in DRAM cell using surface oxidized silicon nodules | Johnson Liu, Jiunn Y. Wu | 1996-04-30 |
| 5494853 | Method to solve holes in passivation by metal layout | — | 1996-02-27 |
| 5492848 | Stacked capacitor process using silicon nodules | Jiunn Y. Wu, Cheng-Hen Huang | 1996-02-20 |
| 5482882 | Method for forming most capacitor using polysilicon islands | Pin-I Chen, Jiunn Y. Wu | 1996-01-09 |
| 5482885 | Method for forming most capacitor using poly spacer technique | Cheng-Hen Huang | 1996-01-09 |
| 5479041 | Non-trenched buried contact for VLSI devices | D. Y. Wu | 1995-12-26 |
| 5472903 | Isolation technology for sub-micron devices | Cheng-Han Huang | 1995-12-05 |
| 5472902 | Silicon-on-insulator isolation technology using liquid phase deposition | — | 1995-12-05 |
| 5466632 | Field oxide with curvilinear boundaries and method of producing the same | Jiun-Yuan Wu | 1995-11-14 |
| 5466630 | Silicon-on-insulator technique with buried gap | — | 1995-11-14 |
| 5466627 | Stacked capacitor process using BPSG precipitates | Jenn-Tarng Lin, Hsiaw-Sheng Chin | 1995-11-14 |
| 5465003 | Planarized local oxidation by trench-around technology | Anna Su, Neng-Hsing Shen | 1995-11-07 |
| 5464794 | Method of forming contact openings having concavo-concave shape | Jiun-Yuan Wu | 1995-11-07 |