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Diffusion barrier enhancement for sub-micron aluminum-silicon contacts |
Chi-Cheng Yang, Kuo-Yun Kuo |
2001-05-01 |
| 6146742 |
Barrier/glue layer on polysilicon layer |
Wen-Yi Hsieh, Chi-Rong Lin, Horng-Bor Lu |
2000-11-14 |
| 6093639 |
Process for making contact plug |
Clint Wu, Horng-Bor Lu |
2000-07-25 |
| 6048788 |
Method of fabricating metal plug |
Hung-Yi Huang, Wen-Yi Hsieh, Chi-Rong Lin |
2000-04-11 |
| 6030892 |
Method of preventing overpolishing in a chemical-mechanical polishing operation |
Kun-Lin Wu, Hao-Kuang Chiu, Horng-Bor Lu |
2000-02-29 |
| 5990004 |
Method for forming a tungsten plug and a barrier layer in a contact of high aspect ratio |
Yu-Ru Yang, Horng-Bor Lu |
1999-11-23 |
| 5950108 |
Method of fabricating a conductive plug |
Clint Wu, Horng-Bor Lu |
1999-09-07 |
| 5897373 |
Method of manufacturing semiconductor components having a titanium nitride layer |
Yuan-Ching Peng, Lih-Juann Chen, Wen-Yi Hsieh, Yong-Fen Hsieh |
1999-04-27 |
| 5883014 |
Method for treating via sidewalls with hydrogen plasma |
Shiaw-Rong Chen, Horng-Bor Lu |
1999-03-16 |
| 5883004 |
Method of planarization using interlayer dielectric |
Hao SHIU, Kun-Lin Wu, Horng-Bor Lu |
1999-03-16 |
| 5876508 |
Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process |
Kun-Lin Wu, Chien-Hsien Lai, Horng-Bor Lu |
1999-03-02 |
| 5716888 |
Stress released VLSI structure by void formation |
Water Lur, Her-Song Liaw |
1998-02-10 |
| 5466627 |
Stacked capacitor process using BPSG precipitates |
Water Lur, Hsiaw-Sheng Chin |
1995-11-14 |
| 5292680 |
Method of forming a convex charge coupled device |
Water Lur, J. Y. Wu |
1994-03-08 |