Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365228 | Process for spin-on coating with an organic material having a low dielectric constant | Cheng-Yuan Tsai, Chin-Hsiang Lin | 2002-04-02 |
| 6362101 | Chemical mechanical polishing methods using low pH slurry mixtures | Juan-Yuan Wu, Water Lur, Shih-Wei Sun | 2002-03-26 |
| 6344408 | Method for improving non-uniformity of chemical mechanical polishing by over coating | Hsueh-Chung Chen, Juan-Yuan Wu, Water Lur | 2002-02-05 |
| 6323123 | Low-K dual damascene integration process | Chih-Chien Liu, Cheng-Yuan Tsai, Anseime Chen | 2001-11-27 |
| 6306757 | Method for forming a multilevel interconnect | Keh-Ching Huang, Tong-Yu Chen, Tzu-Guey Jung | 2001-10-23 |
| 6280079 | Method of mixing slurries | Peng-Yih Peng, Chia-Jui Chang, Juan-Yuan Wu | 2001-08-28 |
| 6214745 | Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy pattern | Yimin Huang, Juan-Yuan Wu, Water Lur | 2001-04-10 |
| 6210256 | Continuous pad feeding method for chemical-mechanical polishing | Hsueh-Chung Chen, Wen-Cheng Yeh | 2001-04-03 |
| 6200653 | Method of forming an intermetal dielectric layer | Cheng-Yuan Tsai, Chih-Chien Liu | 2001-03-13 |
| 6197681 | Forming copper interconnects in dielectric materials with low constant dielectrics | Chih-Chien Liu, Cheng-Yuan Tsai | 2001-03-06 |
| 6169028 | Method fabricating metal interconnected structure | Kun-Chih Wang, Wen-Yi Hsieh | 2001-01-02 |
| 6155912 | Cleaning solution for cleaning a polishing pad used in a chemical-mechanical polishing process | Hsueh-Chung Chen, Juan-Yuan Wu | 2000-12-05 |
| 6077147 | Chemical-mechanical polishing station with end-point monitoring device | Hsueh-Chung Chen, Tsang-Jung Lin, Juan-Yuan Wu | 2000-06-20 |
| 6062964 | Chemical mechanical polishing apparatus for controlling slurry distribution | Hsueh-Chung Chen, Juan-Yuan Wu | 2000-05-16 |
| 6036356 | In-situ slurry mixing apparatus | Chien-Hsin Lai, Chia-Jui Chang, Juan-Yuan Wu | 2000-03-14 |
| 6024106 | Post-CMP wafer clean process | Juan-Yuan Wu, Water Lur | 2000-02-15 |
| 6001733 | Method of forming a dual damascene with dummy metal lines | Yimin Huang, Tri-Rung Yew | 1999-12-14 |
| 5487485 | Liner for a cargo container | Yu-Show Cherng, CHIEN-TE LU | 1996-01-30 |