Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7037802 | Chemical mechanical polishing in forming semiconductor device | Juan-Yuan Wu, Water Lur | 2006-05-02 |
| 6917109 | Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device | Water Lur, David Lee, Kuang-Chih Wang | 2005-07-12 |
| 6905938 | Method of forming interconnect structure with low dielectric constant | Chih-Chien Liu | 2005-06-14 |
| 6858487 | Method of manufacturing a semiconductor device | Water Lur | 2005-02-22 |
| 6790742 | Chemical mechanical polishing in forming semiconductor device | Juan-Yuan Wu, Water Lur | 2004-09-14 |
| 6723609 | Method of preventing leakage current of a metal-oxide semiconductor transistor | Chia-Hung Kao, Chin-Cheng Chien | 2004-04-20 |
| 6677231 | Method for increasing adhesion ability of dielectric material in semiconductor | Cheng-Yuan Tsai, Chin-Hsiang Lin | 2004-01-13 |
| 6616510 | Chemical mechanical polishing method for copper | Chia-Lin Hsu, Teng-Chun Tsai, Yung-Tsung Wei | 2003-09-09 |
| 6609954 | Method of planarization | Kuen-Jian Chen, Juan-Yuan Wu, Water Lur | 2003-08-26 |
| 6596652 | Method of fabricating low dielectric constant film | Neng-Hui Yang | 2003-07-22 |
| 6486079 | Method for stabilizing low dielectric constant materials | Cheng-Yuan Tsai, Yung-Tsung Wei, Teng-Chun Tsai | 2002-11-26 |
| 6461230 | Chemical-mechanical polishing method | Teng-Chun Tsai, Hsueh-Chung Chen | 2002-10-08 |
| 6455432 | Method for removing carbon-rich particles adhered on a copper surface | Teng-Chun Tsai, Chia-Lin Hsu, Yung-Tsung Wei | 2002-09-24 |
| 6440861 | Method of forming dual damascene structure | Chih-Chien Liu, Jui-Tsen Huang, Yi-Fang Cheng | 2002-08-27 |
| 6429152 | Method of forming a thin film on a semiconductor wafer | Neng-Hui Yang | 2002-08-06 |
| 6429115 | Method of manufacturing multilevel interconnects including performing a surface treatment to form a hydrophilic surface layer | Cheng-Yuan Tsai, Chin-Hsiang Lin | 2002-08-06 |
| 6410446 | Method for gap filling | Cheng-Yuan Tsai, Chih-Chien Liu | 2002-06-25 |
| 6410106 | Method of forming an intermetal dielectric layer | Cheng-Yuan Tsai, Chih-Chien Liu | 2002-06-25 |
| 6406978 | Method of removing silicon carbide | Neng-Hui Yang, Chien-Mei Wang | 2002-06-18 |
| 6403469 | Method of manufacturing dual damascene structure | Teng-Chun Tsai, Hsueh-Chung Chen | 2002-06-11 |
| 6387813 | Method for stripping a low dielectric film with high carbon content | Neng-Hui Yang, Chih-Chien Liu | 2002-05-14 |
| 6383913 | Method for improving surface wettability of low k material | Cheng-Yuan Tsai | 2002-05-07 |
| 6380069 | Method of removing micro-scratch on metal layer | Hsueh-Chung Chen, Yung-Tsung Wei | 2002-04-30 |
| 6376394 | Method of forming inter-metal dielectric layer | Cheng-Yuan Tsai, Chih-Chien Liu | 2002-04-23 |
| 6365527 | Method for depositing silicon carbide in semiconductor devices | Neng-Hui Yang | 2002-04-02 |