Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978515 | Electronic component unit and manufacturing method therefor | Isao Kato | 2018-05-22 |
| 9932473 | Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition | Emi Iwatani, Kota Ishikawa, Takayuki Tsuji | 2018-04-03 |
| 9839135 | Method of producing electronic components and method of producing substrate-type terminals | Takashi Watanabe, Junya Shimakawa, Mitsuhide Kato | 2017-12-05 |
| 9801283 | Method of producing electronic components | Takashi Watanabe, Junya Shimakawa | 2017-10-24 |
| 9633922 | Sealing epoxy resin composition, hardened product, and semiconductor device | Kyoko Nishidono, Emi Iwatani, Keigo Takagi | 2017-04-25 |
| 9449838 | Semiconductor device manufacturing method | Kazuki Narishige, Takanori Sato | 2016-09-20 |
| 9396960 | Plasma processing method and plasma processing apparatus | Akira Nakagawa, Hideki Konishi | 2016-07-19 |
| 9099285 | Plasma processing method and plasma processing apparatus | Hiroie Matsumoto | 2015-08-04 |
| 9082720 | Semiconductor device manufacturing method | Katsunori Hirai | 2015-07-14 |
| 9039913 | Semiconductor device manufacturing method | Kazuki Narishige, Takanori Sato | 2015-05-26 |
| 8039758 | Mounting structure for electronic component | — | 2011-10-18 |
| 7297635 | Processing method | Akihito Toda | 2007-11-20 |
| 7285498 | Etching method | Hisataka Hayashi, Tokuhisa Ohiwa, Koichiro Inazawa | 2007-10-23 |