Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9932473 | Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition | Kazuto Ogawa, Kota Ishikawa, Takayuki Tsuji | 2018-04-03 |
| 9633922 | Sealing epoxy resin composition, hardened product, and semiconductor device | Kazuto Ogawa, Kyoko Nishidono, Keigo Takagi | 2017-04-25 |