Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244878 | Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition | Takahiro Akashi | 2022-02-08 |
| 9633922 | Sealing epoxy resin composition, hardened product, and semiconductor device | Kazuto Ogawa, Emi Iwatani, Keigo Takagi | 2017-04-25 |