Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244878 | Semiconductor chip-encapsulating resin composition containing epoxy resin, and semiconductor package including a cured product of the semiconductor-chip-encapsulating resin composition | Kyoko Nishidono | 2022-02-08 |
| 8299193 | Film or laminate comprising ethylene-based resin or ethylene-based resin composition | Masao Suzuki, Yasuo Satoh, Tsutomu Tasaki, Shinya Matsubara, Hideki Bando | 2012-10-30 |
| 8129489 | Ethylene polymer and use thereof | Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Koji Endo, Shiro Otsuzuki +4 more | 2012-03-06 |
| 7700708 | Ethylene polymer and application thereof to moldings | Mamoru Takahashi, Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Shiro Otsuzuki +2 more | 2010-04-20 |