JJ

John I. Jones

TI Texas Instruments: 13 patents #1,059 of 12,488Top 9%
Overall (All Time): #388,859 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6685073 Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer Robert G. McKenna, David Durin, Don Reed Brown, Cecil J. Davis 2004-02-03
5464499 Multi-electrode plasma processing apparatus Mehrdad M. Moslehi, Cecil J. Davis, Robert T. Matthews 1995-11-07
5286297 Multi-electrode plasma processing apparatus Mehrdad M. Moslehi, Cecil J. Davis, Robert T. Matthews 1994-02-15
4891087 Isolation substrate ring for plasma reactor Cecil J. Davis, John E. Spencer, Thomas D. Bonifield, Rhett B. Jucha, William J. Stiltz +2 more 1990-01-02
4886570 Processing apparatus and method Cecil J. Davis, Robert T. Matthews, Lee M. Loewenstein, Rhett B. Jucha, Randall C. Hildenbrand 1989-12-12
4872938 Processing apparatus Cecil J. Davis, Joseph V. Abernathy, Robert T. Matthews, Randall C. Hildenbrand, Bruce Simpson +2 more 1989-10-10
4849067 Method for etching tungsten Rhett B. Jucha, Cecil J. Davis, Duane E. Carter, Sue Crank 1989-07-18
4842686 Wafer processing apparatus and method Cecil J. Davis, Lee M. Loewenstein, Robert T. Matthews, Rhett B. Jucha 1989-06-27
4838990 Method for plasma etching tungsten Rhett B. Jucha, Cecil J. Davis 1989-06-13
4836905 Processing apparatus Cecil J. Davis, Joseph V. Abernathy, Robert T. Matthews, Randall C. Hildenbrand, Bruce Simpson +2 more 1989-06-06
4822450 Processing apparatus and method Cecil J. Davis, Lee M. Loewenstein, Rhett B. Jucha, Robert T. Matthews, Randall C. Hildenbrand +1 more 1989-04-18
4695700 Dual detector system for determining endpoint of plasma etch process John D. Provence, Frederick W. Brown 1987-09-22
4657618 Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate John E. Spencer, Randall E. Johnson, Dan Hockersmith, Randall C. Hildenbrand, William S. Jaspersen 1987-04-14