| 6827449 |
Adhesive-sealed window lid for micromechanical devices |
Homer B. Klonis, Ronald A. Jascott |
2004-12-07 |
| 6685073 |
Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer |
David Durin, Don Reed Brown, Cecil J. Davis, John I. Jones |
2004-02-03 |
| 6471806 |
Method of adhering a wafer to wafer tape |
R. Scott Croff |
2002-10-29 |
| 6248648 |
Method of breaking and separating a wafer into die using a multi-radii dome |
R. Scott Croff, Edwin L. Tom |
2001-06-19 |
| 6184063 |
Method and apparatus for breaking and separating a wafer into die using a multi-radii dome |
R. Scott Croff, Edwin L. Tom |
2001-02-06 |
| 6129811 |
Method of adhering a wafer to a wafer tape |
R. Scott Croff |
2000-10-10 |
| 6028351 |
Gasket sealed integrated circuit package |
Homer B. Klonis, Don W. Hyde, Larry A. Harmon |
2000-02-22 |
| 6007654 |
Noncontact method of adhering a wafer to a wafer tape |
— |
1999-12-28 |
| 5597767 |
Separation of wafer into die with wafer-level processing |
Michael A. Mignardi, Laurinda Ng, Ronald S. Croff, Lawrence D. Dyer |
1997-01-28 |
| 5516125 |
Baffled collet for vacuum pick-up of a semiconductor die |
— |
1996-05-14 |
| 5482899 |
Leveling block for semiconductor demounter |
Michael G. Baxter |
1996-01-09 |