| 6063696 |
Method of reducing wafer particles after partial saw using a superhard protective coating |
Mike Brenner, Timothy J. Hogan, Lisa A. T. Lester, Joseph G. Harden |
2000-05-16 |
| 5817569 |
Method of reducing wafer particles after partial saw |
Mike Brenner, Timothy J. Hogan, Sean O'Brien, Lisa A. T. Lester |
1998-10-06 |
| 5597767 |
Separation of wafer into die with wafer-level processing |
Michael A. Mignardi, Laurinda Ng, Ronald S. Croff, Robert G. McKenna |
1997-01-28 |
| 5595522 |
Semiconductor wafer edge polishing system and method |
Vikki S. Simpson, Tom G. Gullett, Jerry B. Medders, Arthur R. Clark, Bobby R. Robbins +3 more |
1997-01-21 |
| 5424224 |
Method of surface protection of a semiconductor wafer during polishing |
Franklin L. Allen, Eugene C. Davis, Jerry B. Medders, Vikki S. Simpson, Jerry D. Smith +2 more |
1995-06-13 |
| 5289661 |
Notch beveling on semiconductor wafer edges |
Joel B. Jones |
1994-03-01 |
| 5274959 |
Method for polishing semiconductor wafer edges |
Anthony E. Stephens, Frank L. Allen, Jr., Keith M. Easton, James Kennon, Jerry B. Medders +1 more |
1994-01-04 |
| 5240557 |
Semiconductor wafer stacking apparatus and method |
Dempsey McGregor, Robert M. Montgomery, Jerry B. Medders, Michael R. Head, Tom G. Gullett |
1993-08-31 |
| 5128281 |
Method for polishing semiconductor wafer edges |
Anthony E. Stephens, Frank L. Allen, Jr., Keith M. Easton, James Kennon, Jerry B. Medders +1 more |
1992-07-07 |
| 4935064 |
Iodine sterilization of deionized water in semiconductor processing |
John B. Robbins, Mohendra S. Bawa |
1990-06-19 |
| 4502459 |
Control of internal diameter saw blade tension in situ |
— |
1985-03-05 |
| 4501258 |
Kerf loss reduction in internal diameter sawing |
Anderson D. McGregor |
1985-02-26 |
| 4498345 |
Method for measuring saw blade flexure |
Anderson D. McGregor |
1985-02-12 |