Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6063696 | Method of reducing wafer particles after partial saw using a superhard protective coating | Mike Brenner, Timothy J. Hogan, Lisa A. T. Lester, Joseph G. Harden | 2000-05-16 |
| 5817569 | Method of reducing wafer particles after partial saw | Mike Brenner, Timothy J. Hogan, Sean O'Brien, Lisa A. T. Lester | 1998-10-06 |
| 5597767 | Separation of wafer into die with wafer-level processing | Michael A. Mignardi, Laurinda Ng, Ronald S. Croff, Robert G. McKenna | 1997-01-28 |
| 5595522 | Semiconductor wafer edge polishing system and method | Vikki S. Simpson, Tom G. Gullett, Jerry B. Medders, Arthur R. Clark, Bobby R. Robbins +3 more | 1997-01-21 |
| 5424224 | Method of surface protection of a semiconductor wafer during polishing | Franklin L. Allen, Eugene C. Davis, Jerry B. Medders, Vikki S. Simpson, Jerry D. Smith +2 more | 1995-06-13 |
| 5289661 | Notch beveling on semiconductor wafer edges | Joel B. Jones | 1994-03-01 |
| 5274959 | Method for polishing semiconductor wafer edges | Anthony E. Stephens, Frank L. Allen, Jr., Keith M. Easton, James Kennon, Jerry B. Medders +1 more | 1994-01-04 |
| 5240557 | Semiconductor wafer stacking apparatus and method | Dempsey McGregor, Robert M. Montgomery, Jerry B. Medders, Michael R. Head, Tom G. Gullett | 1993-08-31 |
| 5128281 | Method for polishing semiconductor wafer edges | Anthony E. Stephens, Frank L. Allen, Jr., Keith M. Easton, James Kennon, Jerry B. Medders +1 more | 1992-07-07 |
| 4935064 | Iodine sterilization of deionized water in semiconductor processing | John B. Robbins, Mohendra S. Bawa | 1990-06-19 |
| 4502459 | Control of internal diameter saw blade tension in situ | — | 1985-03-05 |
| 4501258 | Kerf loss reduction in internal diameter sawing | Anderson D. McGregor | 1985-02-26 |
| 4498345 | Method for measuring saw blade flexure | Anderson D. McGregor | 1985-02-12 |