Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6063696 | Method of reducing wafer particles after partial saw using a superhard protective coating | Timothy J. Hogan, Lawrence D. Dyer, Lisa A. T. Lester, Joseph G. Harden | 2000-05-16 |
| 5817569 | Method of reducing wafer particles after partial saw | Timothy J. Hogan, Sean O'Brien, Lawrence D. Dyer, Lisa A. T. Lester | 1998-10-06 |